ASMT-MT00 moonstone? tri-color power led light source datafsheet description the moonstone? tri-color power led light source is a high performance energy efcient device which can handle high thermal and high driving current. the exposed pad design enables excellent heat transfer from the package to the motherboard. the low profle package design is suitable for a wide variety of applications especially where height is a constraint. the package is compatible with refow soldering process. this will give more freedom and fexibility to the light source designer. applications ? contour lighting ? cove lighting ? architectural lighting ? garden lighting ? decorative lighting ? commercial lighting ? mood lighting features ? available in tri-color. ? energy efcient. ? exposed pad for excellent heat transfer. ? suitable for refow soldering process. ? high current operation. ? long operation life. ? wide viewing angle. ? silicone encapsulation. ? non-esd sensitive (threshold > 16kv). ? msl 5a products. specifcations ? 3.5 v (max) at 350 ma for ingan ? 2.3 v (max) at 350 ma for alingap ? 120 viewing angle
2 packagefdimensions devicefselectionfguidef(t j f=f25c) f partfnumber f color luminousfflux,f v f [1,2] f(lm) testfcurrent (ma) f diceftechnology min. typ. max. ASMT-MT00 red 33.0 40.0 56.0 350 alingap green 73.0 85.0 124.0 ingan blue 9.0 13.0 19.5 ingan notes: 1. v is the total luminous fux output as measured with an integrating sphere at 25ms mono pulse condition. 2. flux tolerance is 10%. metal slug ( heat sink) 10.00 8.50 0.64 5.25 10.50 1.27 3.30 r+ g+ b+ r+ g- r- b- 1.27 ? 8.00 notes: 1. all dimensions in millimeters. 2. tolerance is 0.1 mm unless otherwise specifed. 3. metal slug is connected to the anode of red.
3 partfnumberingfsystem color bin selection number of flux bins starting from selected x 2 minimum flux bin ASMT-MT00 ? 0 x 1 x 2 x 3 x 4 packaging option note: 1. please refer to page 6 for selection details. absolutefmaximumfratings parameter allngap ingan units dc forward current [1] 350 350 ma peak pulsing current [2] 1000 1000 ma power dissipation 805 1225 mw led junction temperature 125 125 c operating metal slug temperature range at 350 ma -40 to +105 -40 to +105 c storage temperature range -40 to +120 -40 to +120 c soldering temperature refer to figure. 10 note: 1. derate linearly based on figure. 7 for ingan and figure. 8 for alingap. 2. pulse condition duty factor = 10 %, frequency = 1 khz. opticalfcharacteristicsfatf350fmaf(t j f=f25c) partfnumber color peakfwavelength, peak f(nm) dominantfwavelength,f d f[1] f(nm) viewingfangle,f f 2 ? f[2] f() luminousfefciencyf (lm/w) typ. typ. typ. typ. ASMT-MT00 red 635 625 120 54 green 519 525 120 76 blue 454 460 120 12 notes: 1. the dominant wavelength, d , is derived from the cie chromaticity diagram and represents the color of the device. 2. ? is the of-axis angle where the luminous intensity is ? the peak intensity. electricalfcharacteristicfatf350fmaf(t j f=f25c) diceftype forwardfvoltage,f v f f(volts)fatfi f f=f350ma reversefvoltage, v r f[1] thermalfresistance,f r j-ms f(c/w) f[2] min. typ. max. typ. allngap 1.7 2.1 2.3 not recommended 23 ingan 2.8 3.2 3.5 20 notes: 1. not designed for reverse bias operation. 2. r j-ms is thermal resistance from led junction to metal slug. all 3 colors are lighted up at once during measurement.
4 figuref1.frelativefintensityfvs.fwavelength. figuref2.frelativefluminousffluxfvs.fmonofpulsefcurrent. figuref3.fforwardfcurrentfvs.fforwardfvoltage. figuref4.fradiationfpattern. figuref5.fforwardfvoltagefshiftfvs.fjunctionftemperature. figuref6.frelativeflightfoutputfvs.fjunctionftemperature. 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 680 730 780 wavelength - nm relative intensity 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 30 60 90 angular displacement - degrees normalized intensity green blue red 0 5 0 1 0 0 1 5 0 2 0 0 2 5 0 3 0 0 3 5 0 0 1 2 3 4 - 0 . 4 0 - 0 . 3 5 - 0 . 3 0 - 0 . 2 5 - 0 . 2 0 - 0 . 1 5 - 0 . 1 0 - 0 . 0 5 0 . 0 0 0 . 0 5 0 . 1 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 b l u e r e d g r e e n 0 . 0 1 0 . 0 2 0 . 0 3 0 . 0 4 0 . 0 5 0 . 0 6 0 . 0 7 0 . 0 8 0 . 0 9 0 . 0 1 0 0 . 0 1 1 0 . 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 g r e e n r e d b l u e 0.4 0.6 0.8 1 1.2 allngap 0 0.2 ingan allngap 0 50 100 150 200 250 300 350 dc forward current - ma relative luminous flux (normalized at 350 ma) forward voltage - v forward current - ma junction temperature,t relative light output - % (normalized at 25c) j - c junction temperature,t j - c forward voltage shift - v (normalized at 25c) alingap ingan
5 figuref7.fmaximumfforwardfcurrentfvs.fambientftemperaturefforfingan.f deratedfbasedfonft jmax f=f125c,fr j-a f=f30c/w,f40c/wfandff50c/w. figuref8.fmaximumfforwardfcurrentfvs.fambientftemperaturefforfalingap.f deratedfbasedfonft jmax f=f125c,fr j-a f=f30c/w,f40c/wfandff50c/w. figuref9.fmaximumfforwardfcurrentfvs.fmetalfslugftemperature.fderatedf basedfonft jmax f=f125c,fr j-ms f=f20c/wfforfinganfandfr j-ms f=f23c/wfforf alingap. 0 50 100 150 200 250 300 350 400 0 20 40 60 80 100 120 140 ambient temperature, t a - c max allowable dc current - ma 0 50 100 150 200 250 300 350 400 0 20 40 60 80 100 120 140 ambient temperature, t a - c max allowable dc current - ma 0 5 0 1 0 0 1 5 0 2 0 0 2 5 0 3 0 0 3 5 0 4 0 0 0 20 40 60 80 100 120 140 metal slug temperature, t ms - c m a x a l l o w a b l e d c c u r r e n t - m a 217c 200c 150c 60 - 120 sec. -6c/sec. max. 3c/sec. max. 3c/sec. max. 255 - 260c 100 sec. max. 10 - 30 sec. time temperature (acc. to j-std-020c) r j-a = 30c/w r j-a = 40c/w r j-a = 50c/w r j-a = 30c/w r j-a = 40c/w r j-a = 50c/w r j-ms = 20c/w r j-ms = 23c/w 10.00 5.00 7.35 7.50 3.90 3.50 0.64 1.00 1.27 figuref11.frecommendedfsolderingflandfpattern. figuref10.frecommendedfrefowfsolderingf [1] . note: for detail information on refow soldering of avago surface mount leds, do refer to avago application note an1060 surface mounting smt led indicator components.
6 optionfselectionfdetails ASMT-MT00fCf0fx 1 fx 2 fx 3 fx 4 f x 1 C minimum flux bin x 2 C number of flux bins starting from selected x 1 x 3 C color bin selection x 4 C packaging option fluxfbinfselectionf[x 1 ,fx 2 ] individual reel will contain part from 1 bin only. x 1 minimumffluxfbin red green blue 0 full distribution a h j c x 2 numberfofffluxfbinsfstartingffromfselectedfx 1 red green blue 0 full distribution a 2 2 2 b 2 2 3 d 2 3 3 fluxfbinflimitf binfid luminousffluxf(lm)fatfi f f=f350fma min. max. a 5.5 7.0 b 7.0 9.0 c 9.0 11.5 d 11.5 15.0 e 15.0 19.5 f 19.5 25.5 g 25.5 33.0 h 33.0 43.0 j 43.0 56.0 k 56.0 73.0 l 73.0 95.0 m 95.0 124.0 tolerance for each bin limits is 10% colorfbinfselectionf[x 3 ] individual reel will contain part from 1 bin only. x 3 colorfbinfcombination red green blue 0 full distribution a, b, c and d a, b, c and d packagingfoptionf[x 4 ] selection option 1 tape and reel example ASMT-MT00-00001 x 1 = 0 C full distribution x 2 = 0 C full distribution x 3 = 0 C red (full distribution), green (a, b, c and d), blue (a, b, c and d) x 4 = 1 C tape and reel option colorfbinflimit color binfid min. max. red full distribution 620.0 635.0 green a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 blue a 455.0 460.0 b 460.0 465.0 c 465.0 470.0 d 470.0 475.0 tolerance: 1 nm
7 cief1931fchromaticityfdiagram figuref12.fcief1931fchromaticityfdiagram. tapefandfreelfCfoptionf1 figuref13.fcarrierftapefdimensions. dim value a 0 8.80 0.10 b 0 16.45 0.10 k 0 3.60 0.1 e 1.75 0.10 f 11.50 0.10 w 24.0 0.10 p 16.0 0.10 q'ty/reel 250 units all dimensions in mm. a a b a o b p sec tion b sec tion a k o w f e bo 2.5 0 . 0 0 0 . 1 0 0 . 2 0 0 . 3 0 0 . 4 0 0 . 5 0 0 . 6 0 0 . 7 0 0 . 8 0 0 . 9 0 0 . 0 0 0 . 1 0 0 . 2 0 0 . 3 0 0 . 4 0 0 . 5 0 0 . 6 0 0 . 7 0 0 . 8 0 y - c o o r d i n a t e x - c o o r d i n a t e r e d c d g r e e n b l u e b a c b d a
8 figuref14.fcarrierftapefleaderfandftrailerfdimensions. end minimum of 160 mm of empty component pockets sealed with cover tape. mounted with components minimum of 390 mm of empty component pockets sealed with cover tape. start *not e: t ape & r eel p ack ag ing only applicable as per this da tasheet only . figuref15.freelfdimensions. r10.00 60.0o ? 268.00 ? 330.00 1.00 ? 99.50 1.00 2.30 2.30 24.0 +1.00 ?0.00 ? 13.50 0.50 2.50 0.50 r10.50 0.50 120.0o
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2014 avago technologies. all rights reserved. av02-1693en - february 6, 2014 handlingfprecaution the encapsulation material of the product is made of silicone for better reliability of the product. as silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. these might damage the product and cause premature failure. during assembly or handling, the unit should be held on the body only. please refer to avago application note an5288 for detail information. moisturefsensitivity this product is qualifed as moisture sensitive level 5a per jedec j-std-020. precautions when handling this moisture sensitive product is important to ensure the reliability of the product. do refer to avago application note an5305 handling of moisture sensitive surface mount devices for details. a. storage before use C unopened moisture barrier bag (mbb) can be stored at <40c/90%rh for 12 months. if the actual shelf life has exceeded 12 months and the humidity indicator card (hic) indicates that baking is not required, then it is safe to refow the leds per the original msl rating. C it is not recommended to open the (mbb) prior to assembly (e.g. for iqc). b. control after opening the mbb C the humidity indicator card (hic) shall be read immediately upon opening of mbb. C the leds must be kept at <30c/60%rh at all time and all high temperature related process including soldering, curing or rework need to be completed within 24 hours. c. control for unfnished reel C for any unused leds, they need to be stored in sealed mbb with desiccant or desiccator at <5%rh. d. control of assembled boards C if the pcb soldered with the leds is to be subjected to other high temperature processes, the pcb need to be stored in sealed mbb with desiccant or desiccator at <5%rh to ensure no leds have exceeded their foor life of 24 hours. e. baking is required if: C hic 10% indicator is not blue and 5% indicator is pink. C the leds are exposed to condition of >30c/60% rh at any time. C the leds foor life exceeded 24 hours. recommended baking condition: 605c for 20hrs. disclaimer : avagos products and software are not specifcally designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
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